Duy-Loan Le began her career at Texas Instruments (TI) as a memory design engineer. Since then, Le has taken on positions of increasing responsibility at TI, leading key teams to complete projects that have made a significant impact on science, technology and the high-tech industry. Currently, she manages development projects for wireless communications as TI program manager for Laplace (a DSP chip for 3G base stations) and manager of DSP Advanced Ramp.

Ms. Le holds 18 patents and has 10 pending applications. She has developed a six-month technical training program that was distributed to seven TI sites in five different countries and has published three papers.

Ms. Le shares herself and her time unselfishly, speaking annually at numerous national events to help create an environment that stimulates and releases leadership potential in women. She graduated magna cum laude from the University of Texas with a BSEE at the age of 19. She earned her MBA from the University of Houston while working and traveling on a full-time basis.

• Profile updated in 2009